License for 3D stacked image sensor technology supports ToF, advanced sensor manufacturing

Xperi Holding Corporation and Tower Semiconductor announced Tower's license of Invensas ZiBond and DBI 3D semiconductor interconnect technologies. This technology complements Tower's manufacturing of its state of the art stacked wafer BSI sensor platforms for time of flight (ToF), industrial global shutter and other CMOS image sensors on 300mm and 200mm wafers. In addition, Tower […] The post License for 3D stacked image sensor technology supports ToF, advanced sensor manufacturing appeared fi...